Case study: Moldex3D IC Packaging Module
In this case study from Moldex3D they talk about their work with semiconductor company, STMicroelectronics.
STMicroelectronics engineers minimize the risk of incomplete resin filling by employing Moldex3D IC Packaging solution. First, the software allows to reproduce void formation caused by unbalanced flow behavior. Then, Moldex3D simulation is applied to optimized package design to reduce the risk of issues.
As a result, geometric variations show a significant effect on filling front progression avoiding the generation of structural defects during the molding process. Virtual failure anticipation with Moldex3D is successful and results are transferred to package prototyping for new product integration.
Moldex3D will be exhibiting at the Injection Molding and Design Expo 2022.